-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Breaking News: Relive the Experience: Real Time with… IPC APEX EXPO 2024 Show & Tell Magazine
You came, you saw, and you experienced the magic of IPC APEX EXPO 2024. Now you get to relive the many memories and experiences in the pages of Real...
BTU International Displays Multiple Reflow Solutions at SMTconnect 2024
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is pleased to announce...
Kimball Electronics Thailand Helps Save Lives by hosting Blood Drive
Kimball Electronics Thailand employees took part in a blood donation event. The blood drive took place in the Rajapruek Building at Laem Chabang...
Foxconn Announces Q1 2024 Financial Results
In the January-March quarter revenue hit NT$1.324 trillion, with key profit margins all improving. Earnings per share for the first three months of 2024 reached...
Kitron: Completed Share Buyback in Connection with Remuneration to the Board Members
Kitron ASA has completed share buyback in connection with remuneration to the board members. Reference is made to the stock exchange release by...
Indium Experts to Present at Electronics in Harsh Environments SMTA Conference
ndium Corporation Technical Manager for Europe, Africa, and the Middle East, Karthik Vijay, will deliver a technical presentation and Indium...
Click Here for More News
We search high and low to find the best news for you, our valuable readers…
If you have news you would like to publish here please send your news item to: news@iconnect007.com
Click here for press release tips
Real Time with… IPC APEX EXPO 2024: Digitization and Regular Updates of the iNEMI Industry Roadmap
May 14, 2024 | Real Time with...IPC APEX EXPO
Ranjan Chatterjee is a board member at iNEMI. In this conversation with Editor Nolan Johnson, Chatterjee discusses the digitization of, and regular updates to, the industry roadmap. The roadmap is a collaborative effort on technologies and standards which is intended to guide CEOs and CTOs in their long-range planning. Ranjan discusses the board's role in shaping the roadmap and the vision for more frequent updates.
Viscom’s Approach to Inline X-Ray
May 14, 2024 | Barry Matties, I-Connect007
In this interview, Viscom President Ed Moll and CEO Jesper Lykke discuss the importance of inline X-rays for real-time data and board inspection. They also discuss AI integration, customer inquiries, and ROI considerations. Also, as Ed moves into semi-retirement, he reflects on his long career, recent developments, and the evolving X-ray industry. He shares his insights on career opportunities for emerging engineers in the industry.
MORE ARTICLES
Nolan’s Notes: Coming to Terms With AI
May 7, 2024 | Nolan Johnson, Nolan's Notes
How fast do things move in the world of data analytics? Here’s an example. We’ve been planning this issue on artificial intelligence for the past few months, and, in fact, I had already written this column about a month ago. Then...
The Knowledge Base: A CM’s Perspective on Box Build Practices
April 30, 2024 | Mike Konrad, The Knowledge Base
In the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic...
SMT Prospects and Perspectives: AI Opportunities, Challenges, and Possibilities, Part 1
April 17, 2024 | Dr. Jennie Hwang, SMT Perspectives and Prospects
In this installment of my artificial intelligence (AI) series, I will touch on the key foundational technologies that propel and drive the development and deployment of AI, with special consideration of electronics packaging and...
Nolan’s Notes: Do More, Get More
April 2, 2024 | Nolan Johnson, Nolan's Notes
This month in SMT007 Magazine, we’re investigating box build, a manufacturing sector so closely adjacent to board assembly that some OEM customers they’re the same thing. To those of us doing this work, we know they’re very...
Are you missing out?
Customize your section here.
Edit List Settings
- Using AI to Redefine Productivity with Amin Arbabian, Anders Holden, Raj Vora, and Luis Vidal
- Empowering the Smart Factory Era With AI by Joel Scutchfield and Brent Fischthal
- A Glossary of Artificial Intelligence Terms
- Chiplet Architecture for AI Will Create New Demands for Assembly with Arvind Kumar
- The Rise of Collaborative Intelligence in Manufacturing by Jennifer Davis